Self-adaptable package for designing on-chip network
Title：
Self-adaptable package for designing on-chip network
Application Number：
 200710117718
Application Date：
 2007/06/22
Announcement Date：
 2007/11/21
Pub. Date：
Publication Number：
 101075961
Announcement Number：
Grant Date：
Granted Pub. Date：
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 H04L 12/56H04L 29/02
Applicant(s)：
 Tsinghua Univ.
Inventor(s)：
 Lin Shijun, Zeng Lieguang, Jin Depeng, Su Lin
Key Words：
 Self-adaptable, package, on-chip network
Abstract：
 The method feature the following: setting up a data source buffer area at IP block; setting up a packager and a packaging buffer area at the network interface; after system initiation, the packager is at a idle state; when the data source buffer area is not empty and the packaging buffer area is not full, the packager inserts header and tailor and body micro plate, and enters into the busy state; if the data source buffer area is not empty and the packaging buffer area is not full, and the destination address of the data is not changed, the packager inserts the body micro plate; if the destination address in the data buffer source area is changed or the data source buffered area and the packaging buffer area both are empty, the packager inserts the body micro plate and enters into idle state.
Claim：
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PCT：
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