High-heat-conductance electronic packaging material and its preparing method
Title：
High-heat-conductance electronic packaging material and its preparing method
Application Number：
 200610113307
Application Date：
 2006/09/22
Announcement Date：
 2007/03/28
Pub. Date：
Publication Number：
 1935926
Announcement Number：
Grant Date：
Granted Pub. Date：
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 C09K 3/10, H01L 23/29
Applicant(s)：
 Tsinghua Univ.
Inventor(s)：
Key Words：
 High-heat-conductance, electronic, packaging material, preparing method
Abstract：
 The invention relates to high thermal conduction electronic package material. Its components are as follows filling powder 10-80%, epoxy resin 5-30%, curing agent 10-65%, curing accelerating agent 0.1-2.5%, release agent 0.5-3%, colorant 0.5-3%, and proper flame retardant and thixotropic agent. The filling powder can be beta phase silicon nitride powder, or the mixture of the beta phase silicon nitride powder and the silicon dioxide whose adding proportion is 5-95% of the filling total weight. The invention uses beta phase silicon nitride powder as the filling to increase material electrical thermal, property, and mechanical properties, optimize filling powder size distribution to increase package material thermal conductivity and high temperature fluidity, mixes the beta phase silicon nitride powder and silicon dioxide to use as filling to make the package material thermal conductivity and expansion coefficient controllable, and greatly shorten industrialization production transformation period.
Claim：
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