Flash memory cell and its preparing process
Title:
Flash memory cell and its preparing process
Application Number:
02123441
Application Date:
2002/06/28
Announcement Date:
2002/12/25
Pub. Date:
Publication Number:
1387263
Announcement Number:
1176493
Grant Date:
2004-11-17
Granted Pub. Date:
2004-11-17
ApplicationType:
Invention
State/Country:
11[China|beijing]
IPC:
H01L 21/8239, H01L 21/8246, H01L 27/10, H01L 27/112
Applicant(s):
Tsinghua Univ
Inventor(s):
Pan Liyang, Zhu Jun
Key Words:
Flash memory cell, preparing process
Abstract:
The flash storage unit includes a semi-conductor substrate of P type and P pit in the said substrate a includes a semi-conductor substrate of P type and P pit in the said substrate, a tunnelling the oxidation layer on the semi-conductor substrate, a stacked grid structure including floating grid and control grid of which floating grid is isolated to the control grid through the composite media layer of silica/silicon nitride/silica, on the tunnelling thin oxidation layer; a source region consisting of a n(-) source region injected by low concentration phosphorus and prolongated below the floating grid as well as a n(-) source region injected by high concentration arsenic, it the substrate of the first edge of the said stacked grid structure, a drain regino consisting of a n(-) drain regino injected by low concentration phosphorus.
Claim:
Priority:
PCT:
LegalStatus:

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