Method for manufacturing radio-frequency micro-machinery series contact type switch
Title：
Method for manufacturing radio-frequency micro-machinery series contact type switch
Application Number：
 200710176082
Application Date：
 2007/10/19
Announcement Date：
 2008/03/19
Pub. Date：
Publication Number：
 101143701
Announcement Number：
Grant Date：
Granted Pub. Date：
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 B81C 1/00
Applicant(s)：
 Tsinghua University
Inventor(s)：
 Liu Zewen, Hu Guangwei, Liu Litian, Li Zhijian
Key Words：
 manufacturing method, radio-frequency, micro-machinery, series contact type, switch
Abstract：
 The invention relates to a method of manufacturing a serial contact switch of a radio frequency micro machine, which belongs to the technical field of manufacturing semi-conductor components and integrated circuits. The method includes the following steps: taking silicon wafers as the supporting base, and cleaning; spattering, plating, deposition, photolithograph and etching, to form the coplanar waveguide and a bottom electrode; sacrificial layer spin coating and solidification, metal spattering and medial deposition; graphics, to form a bridge membrane switch with series of holes; lateral undercutting; release of the sacrificial layer. The method can prevent stress concentration of the media and the bridge membrane, improve the mechanical reliability of the switch, improve the finished product rate and extend the service life of the switch; meanwhile, the method is compatible with the CMOS process, and expected to be widely applicable.
Claim：
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