A method for obtaining low bit discrepancy density extension thin film via using neck down extension
Title:
A method for obtaining low bit discrepancy density extension thin film via using neck down extension
Application Number:
200710176856
Application Date:
2007/11/06
Announcement Date:
2008/03/26
Pub. Date:
Publication Number:
101150054
Announcement Number:
Grant Date:
Granted Pub. Date:
ApplicationType:
Invention
State/Country:
11[China|beijing]
IPC:
H01L 21/20
Applicant(s):
Tsinghua University
Inventor(s):
Zhao Shuo, Liang Renrong, Liu Jialei, Wang Jing, Xu Yang, Liu Zhihong, Xu Jun
Key Words:
low bit discrepancy density, extension thin film, neck down extension
Abstract:
This invention discloses a method for using necking extension to get extension films of low dislocation density, which utilizes deposition, selective extension and thermal oxidation to prepare GeSi substrates of low dislocation density and channels of high migration rate and gets films of exremely low dislocation density on a silicon wafer meeting the requirement of MOS devices or luminescent devices.
Claim:
Priority:
PCT:
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