Device for preparing welding tin ball
Title：
Device for preparing welding tin ball
Application Number：
 200710175421
Application Date：
 2007/09/29
Announcement Date：
 2008/02/20
Pub. Date：
Publication Number：
 101125369
Announcement Number：
Grant Date：
Granted Pub. Date：
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 B22F 9/08
Applicant(s)：
 Qinghua UniversityLiuzhou Huaxi Group Co., Ltd.
Inventor(s)：
 Lu Zhenming, Shao Youlin, Hao Shaochang, Liang Tongxiang, Zhang Jie, Liao Chuntu, Su Jiahong, Chen Jinzhong, Wang Xuehong
Key Words：
 preparing device, welding tin ball
Abstract：
 The present invention discloses a device of preparing soldering balls. belonging to the technology field of packing materials for electronic products. The device includes a feed system, a liquid dispersion mechanism, a liquid drop solidification-and-formation system; wherein the feed system contains a bath(1) and a feed pot(24). Through the control of a pipeline and a valve, the feed system is capable of providing materials continuously during the production, so as to ensure the stable feed flow; whereas the liquid drop solidification-and-formation system contains a gas distributing ring(13) and a forming column(15), wherein the gas distributing ring(13) is connected with the forming column(15). Through the control of the airflow, two layers of airflow with different temperatures are formed on a traveling space of the soldering liquid drop, thus ensuring the soldering liquid drops to become round and solid. The liquid dispersion mechanism includes a corrugated compensator(11) tightly connected with a distributor(9) and an air distribution ring(13), the distributor is connected with the connecting rod(28) which can vibrates up and down, and the mechanism has simple and practical structure. The invention realizes the continuous production, and the device is very compact thus being convenient to be operated.
Claim：
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PCT：
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