Production for multi-layer thin-film structure of diamond sound surface wave device |
Title： |
| Production for multi-layer thin-film structure of diamond sound surface wave device |
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Application Number： |
200410096819 |
Application Date： |
2004/12/07 |
Announcement Date： |
2005/07/27 |
Pub. Date： |
2006/04/19 |
Publication Number： |
1645744 |
Announcement Number： |
1252916 |
Grant Date： |
2006-4-19 |
Granted Pub. Date： |
2006-4-19 |
ApplicationType： |
Invention |
State/Country： |
11[China|beijing] |
IPC： |
H03H 3/08 |
Applicant(s)： |
Qinghua Univ. |
Inventor(s)： |
Pan Feng, Li Dongmei, Wang Xubo |
Key Words： |
Production, multi-layer thin-film structure, diamond, sound surface wave device |
Abstract： |
The method includes following steps: first the graphic of Surface Acoustic Wave (SAW) device is photo etched on diamond film surface; IIIA group element or VA group element are injected into the place of graphic by using ion implantation method; the polycrystal ZnO film is deposited on the diamond surface; finally the photoresist is removed, and the transducer graphic is obtained. Through injecting the ion, the surface resistivity is greatly reduced and conducting power is greatly increased. |
Claim： |
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Priority： |
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PCT： |
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LegalStatus： |
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