High connecting intensity thermosetting conducting resin
Title：
High connecting intensity thermosetting conducting resin
Application Number：
 200310117092
Application Date：
 2003/12/09
Announcement Date：
 2004/11/17
Pub. Date：
Publication Number：
 1546591
Announcement Number：
 2003/12/09
Grant Date：
 2006-1-25
Granted Pub. Date：
 2006-1-25
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 C09J 163/00C09J 9/02
Applicant(s)：
 Tsinghua University
Inventor(s)：
 Liang Tongxiang, Wang Juan, Yan Yinghui
Key Words：
 connecting intensity, thermosetting, conducting resin
Abstract：
 The invention discloses a high connecting intensity thermosetting conducting resin by selecting glycidol ester epoxy resin as conducting resin base, micrometer level silver powder as conductive gasket material, diaminodiphenylmethane and m-phenylenediamine as hardening agent, silicane coupling agent (3-epihydrin ether oxypropyl trimethylsilicane) as dispersing agent, nanometer level silicon oxide as flexibilizer. The resin is prepared by medium temperature hardening method.
Claim：
Priority：
PCT：
LegalStatus：

Recommend this patent:
1 2 3 4 5
Average ( 0 votes):
                                                                          Recommended Patents>>

Relevancy information



Other Patents of Same Inventor

Device for preparing welding tin ball
Process for synthesis of monodisperse micron crosslinked polystyrene copolymerization microsphere
Process for preparing graphite surface anti oxidation coating material silicon carbide for nuclear reactor
Polymer fiber containing carbon nano tube structure
Radiation dispersion polymerization process of phenylethylene micro ball
Photo-catalyst of nano carrier
Method of preparing antioxidation coating for gvaphite surface of nuclear reactor
Method for preparing porous silicon carbide ceramic with high porosity
Chemical method for silver coating on copper powder surface
Method of preparing UO2 ceramic fuel microsphere
Method of preparing electric conductive adhesive by chemical plating silver on graphite powder surface
System for preparing gel bead



News & Events More>>

Last Update  
2008-4-17
  Selected patents owned by Tsinghua University filed in 2005 are loaded.
2008-3-31
  Selected patents owned by Tsinghua University filed in 2006 and 2007 are load.







Copyright 2008-2015 All Rights Reserved Patent License of China.      Designed by Easygo