Method for preparing high curie point piezoelectric using water base sol-gel method |
Title： |
| Method for preparing high curie point piezoelectric using water base sol-gel method |
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Application Number： |
200610058722 |
Application Date： |
2006/03/03 |
Announcement Date： |
2006/08/23 |
Pub. Date： |
2007/12/19 |
Publication Number： |
1821172 |
Announcement Number： |
100355697 |
Grant Date： |
2007-12-19 |
Granted Pub. Date： |
2007-12-19 |
ApplicationType： |
Invention |
State/Country： |
11[China|beijing] |
IPC： |
C04B 35/462, C04B 35/624, H01L 41/187 |
Applicant(s)： |
Tsinghua Univ. |
Inventor(s)： |
Wang Xiaohui, Wen Hai, Li Longtu, Gui Zhilun |
Key Words： |
high curie point piezoelectric, water base sol-gel method |
Abstract： |
The present invention belongs to the field of piezoelectric film material preparing technology, and is water base sol-gel process of preparing high Curie point piezoelectric film. Tetrabutyl titanate and nitrate and acetate of other metal cation as main material and glacial acetic acid and deionized water as main solvent are first prepared into stable sol and the sol is coated and fast annealed to form the piezoelectric film with compact structure and homogeneous components. The piezoelectric film has excellent piezoelectric performance, Curie point as high as 435 deg.c, crystal grain size of 20-100 nm, effective piezoelectric coefficient d33*of about 80 pC/N, comparable with that of the PZT film, and thickness controllable in 0.15-1 micron. The piezoelectric film is suitable for various piezoelectric ferrite elements and devices used in high temperature, and may find wide application in space, automobile and other industrial fields. |
Claim： |
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Priority： |
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PCT： |
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LegalStatus： |
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