Thermal dielectric surface material and prepn. process |
Title: |
Thermal dielectric surface material and prepn. process |
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Application Number: |
200510033746 |
Application Date: |
2005/03/19 |
Announcement Date: |
2006/09/20 |
Pub. Date: |
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Publication Number: |
1834190 |
Announcement Number: |
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Grant Date: |
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Granted Pub. Date: |
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ApplicationType: |
Invention |
State/Country: |
11[China|beijing] |
IPC: |
C09K 5/06, C08L 101/00, C08K 3/04 |
Applicant(s): |
Tsinghua Univ. |
Inventor(s): |
Liu Changhong, Fan Shoushan |
Key Words: |
Thermal dielectric surface material, prepn. process |
Abstract: |
This invention relates to a method for manufacturing a thermal interface material, which is composed of a polymer phase change material matrix, additive and carbon nanotubes dispersed in the polymer matrix. At least part of the carbon nanotubes protrude from the polymer matrix. The thermal interface material is manufactured by: melting the polymer phase change material and the additive to obtain a mixture, adding the carbon nanotubes into the mixture and dispersing, curing and slicing to obtain the final product. The method does not need any complicated or expensive manufacturing peocess, and can manufacture the thermal interface material in a large scale with a low manufacturing cost. Besides, part of the carbon nanotubes protrude from the polymer matrix, thus facilitating the thermal interface material with good heat conductivity. The thermal interface material can be widely used in heat eliminating technique for semiconductor devices. |
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