Method of mfg micron/nanometer combined structural element
Title:
Method of mfg micron/nanometer combined structural element
Application Number:
200510053865
Application Date:
2005/03/14
Announcement Date:
2006/09/20
Pub. Date:
Publication Number:
1833999
Announcement Number:
Grant Date:
Granted Pub. Date:
ApplicationType:
Invention
State/Country:
11[China|beijing]
IPC:
B81C 1/00
Applicant(s):
Tsinghua Univ.
Inventor(s):
Zhou Zhaoying, Zhu Rong, Wang Dingqu, Ye Xiongying
Key Words:
micron, nanometer. combined structural, element
Abstract:
A process for preparing the device with the micron-nano combined structure includes such steps as doping on substrate to form substrate electrode, generating an insulating layer but exposing substrate electrode, depositing a sacrifice layer but exposing substrate electrode, depositing a polysilicon layer, doping, sputtering a metal layer, generating mass block, electrode and base, etching the sacrifice layer under mass block, fixing one-dimension nano material to electrode and mass block, and etching the connecting beam between base and mass block.
Claim:
Priority:
PCT:
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2008-4-17
  Selected patents owned by Tsinghua University filed in 2005 are loaded.
2008-3-31
  Selected patents owned by Tsinghua University filed in 2006 and 2007 are load.







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