Method for controlling pre-aligning of silicon wafer |
Title： |
| Method for controlling pre-aligning of silicon wafer |
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Application Number： |
200510116695 |
Application Date： |
2005/10/28 |
Announcement Date： |
2006/06/14 |
Pub. Date： |
2007/12/12 |
Publication Number： |
1787200 |
Announcement Number： |
100355055 |
Grant Date： |
2007-12-12 |
Granted Pub. Date： |
2007-12-12 |
ApplicationType： |
Invention |
State/Country： |
11[China|beijing] |
IPC： |
H01L 21/68, G03F 7/20, G05B 15/00 |
Applicant(s)： |
Tsinghua Univ. |
Inventor(s)： |
Song Yixu, Li Shichang, Zhao Yannan, Yang Zehong, Wang Jiaqin, Jia Peifa, Mu Qiang |
Key Words： |
silicon wafer, pre-aligning, controlling method |
Abstract： |
The invention belongs to the field of computer numerical control, especially relating to a method fro controlling silicon wafer prealignment, comprising : a silicon wafer locating method comprising circular sampling of silicon wafer, data preprocessing, circle fitting and silicon wafer centering; and a gap locating method comprising gap rough locating, gap fine sampling, gap fitting and angling the gap center. The invention can largely improve the aligning accuracy. |
Claim： |
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Priority： |
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PCT： |
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LegalStatus： |
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