Method for preparing integrated circuit copper interconnecting line and barrier layer with ultrasonic chemistry |
Title： |
| Method for preparing integrated circuit copper interconnecting line and barrier layer with ultrasonic chemistry |
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Application Number： |
200710063133 |
Application Date： |
2007/01/29 |
Announcement Date： |
2007/08/08 |
Pub. Date： |
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Publication Number： |
101013679 |
Announcement Number： |
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Grant Date： |
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Granted Pub. Date： |
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ApplicationType： |
Invention |
State/Country： |
11[China|beijing] |
IPC： |
H01L 21/768C23C 18/40C23C 18/18 |
Applicant(s)： |
Tsinghua University |
Inventor(s)： |
Yang Zhigang, Wang Jing |
Key Words： |
integrated circuit, copper, interconnecting line, barrier layer, ultrasonic chemistry, preparation |
Abstract： |
The invention relates to one supersonic chemical coating to process integration circuit wires and its block layer, wherein, it uses acetaldehyde acid as restore agent and blue copperas acid as main salt and added with combination agent, stable agent and bubble agent; it uses supersonic function on activated metal or its nitrogen block layer depositing one layer of copper coating layer on baseboard with good cover and combination ability; for supersonic chemical costing to process circuit block layer by use of atom activation method by use of supersonic chemical coating method on dioxide silicon layer. |
Claim： |
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Priority： |
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PCT： |
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LegalStatus： |
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