Method for quick picking up 3D interlinked stray inductance of conductor based on environment of open circuit
Title：
Method for quick picking up 3D interlinked stray inductance of conductor based on environment of open circuit
Application Number：
 200510011954
Application Date：
 2005/06/17
Announcement Date：
 2005/11/16
Pub. Date：
 2007/08/22
Publication Number：
 1696941
Announcement Number：
 1333364
Grant Date：
 2007-8-22
Granted Pub. Date：
 2007-8-22
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 G06F 17/50
Applicant(s)：
 Tsinghua Univ.
Inventor(s)：
 Wang Zeyi, Wei Hongchuan, Yu Wenjian
Key Words：
 open circuit, conductor, 3D, interlinked, stray inductance, quick picking up
Abstract：
 A picking up method includes using open - circuit environmental conductor to replace closed loop conductor to quickly pick up 3D interconnection stray inductance i e making the other conductors be two sections - open circuit when main conductor is added on with one nu bias, then deriving out threadlet impedance matrix and using circuit equation to solve out threadlet current and total current on conductor for obtaining conductor impedance matrix from where can have 3D interconnection stray inductance.
Claim：
Priority：
PCT：
LegalStatus：

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2008-4-17
  Selected patents owned by Tsinghua University filed in 2005 are loaded.
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