Supercritical separating method and system for waste printing circuit boards
Title：
Supercritical separating method and system for waste printing circuit boards
Application Number：
 200510121111
Application Date：
 2005/12/29
Announcement Date：
 2006/08/16
Pub. Date：
 2007/08/15
Publication Number：
 1818100
Announcement Number：
 1332048
Grant Date：
 2007-8-15
Granted Pub. Date：
 2007-8-15
ApplicationType：
 Invention
State/Country：
 94[China|shenzhen]
IPC：
 C22B 7/00, C22B 3/04
Applicant(s)：
 Shenzhen Graduated School, Tsinghua Univ.
Inventor(s)：
 Zhang Guangming, Wang Huan, Yin Fengfu, Yu Zida, Liu Zhenyu
Key Words：
 waste printing circuit boards, supercritical, separating, method, system
Abstract：
 The invention is about the supercritical separating method of the waste printed substrate. It includes: a. breaking up the waste printed substrate and put it into the supercritical reactor, then add into the reactive resolvent, then rise the temperature to above less than 50¡æ of the supercritical point temperature, and force to above supercritical pressure for 30-90min, so the resin material of the printed substrate would be separated from the metal; b. drop in temperature and the pressure, when the pressure is 3atm and the temperature is less than the supercritical point temperature of the resolvent, the fluid containing the resin and the metal is sent into the three-phase segregator to separate. The recovery rate of the metal can reach above 90% in the invention.
Claim：
Priority：
PCT：
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Last Update  
2008-4-17
  Selected patents owned by Tsinghua University filed in 2005 are loaded.
2008-3-31
  Selected patents owned by Tsinghua University filed in 2006 and 2007 are load.







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