Process for preparing electrically insualting metal substrate with excellent resistance to heat shock
Title：
Process for preparing electrically insualting metal substrate with excellent resistance to heat shock
Application Number：
 02123427
Application Date：
 2002/06/28
Announcement Date：
 2003/02/19
Pub. Date：
Publication Number：
 1397665
Announcement Number：
 1233873
Grant Date：
 2005-12-28
Granted Pub. Date：
 2005-12-28
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 C23C 28/00, C25D 11/04
Applicant(s)：
 Tsinghua Univ
Inventor(s)：
 Ma Jusheng, Zhu Jiman, Guo Liquan
Key Words：
 preparing process, electrically insualting metal substrate, resistance to heat shock
Abstract：
 An insulative metal substrate with excellent heat shock resistance is prepared from Al sheet through washing in alkali solution, electrolytic polishing, anodizing to prepare insulative layer, baking, depositing copper layer by sputter, evaporation, or chemical plating, and electroplating to increase the thickness of Cu layer to 10-35 microns. Its advantages are high resistance to heat shock, high insulative resistivity greater than 10 to the power 13 ohm.cm, and high breakdown voltage (1000 v).
Claim：
Priority：
PCT：
LegalStatus：

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