Electroplating cup with adjustable spacing between cathode, anode and uniform stream plate in wafer level package
Title：
Electroplating cup with adjustable spacing between cathode, anode and uniform stream plate in wafer level package
Application Number：
 02159933
Application Date：
 2002/12/30
Announcement Date：
 2004/07/14
Pub. Date：
Publication Number：
 1511977
Announcement Number：
 1238571
Grant Date：
 2006-1-25
Granted Pub. Date：
 2006-1-25
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 C25D 5/02, C25D 5/08, C25D 7/12, C25D 17/00, H01L 23/532, H01L 21/48
Applicant(s)：
 Tsinghua Univ.
Inventor(s)：
 Wang Shuidi, Jia Songliang, Hu Tao
Key Words：
 Electroplating cup, adjustable spacing, cathode, anode, uniform stream plate, wafer level package
Abstract：
 The present invention belongs to the field of IC packing technology. The electroplating cup includes one cup comprising an inner cup with electrolyte inlet in the lower part, an outer cup with electrolyte outlet in the lower part and a cover plate; cathode (silicon wafer) fixed to the bottom of the cover plate; regulating rings in different heights inside the inner cup, current equalizing plate, anode and regulating ring fixing rings inside the inner cup; and outer cup cover to form the electrolyte outlet passage together with the fixing ring. On the cover plate, there are regulating screws for the regulation of the intervals between the anode or the cathode and the current equalizing plate and the cross section width of the electrolyte outlet. The anode is non-consumptive platinum-plating titanium net capable of adapting different size of silicon wafer and has long service life and less maintenance.
Claim：
Priority：
PCT：
LegalStatus：

Recommend this patent:
1 2 3 4 5
Average ( 0 votes):
                                                                          Recommended Patents>>

Relevancy information



Other Patents of Same Inventor

Automatic operator assembly for hand-operated valve



News & Events More>>

Last Update  
2008-4-17
  Selected patents owned by Tsinghua University filed in 2005 are loaded.
2008-3-31
  Selected patents owned by Tsinghua University filed in 2006 and 2007 are load.







Copyright 2008-2015 All Rights Reserved Patent License of China.      Designed by Easygo