Fast semiconductor heat-treating facility with vertical heat treating chamber
Title：
Fast semiconductor heat-treating facility with vertical heat treating chamber
Application Number：
 200310112926
Application Date：
 2003/12/26
Announcement Date：
 2005/07/06
Pub. Date：
 2007/12/19
Publication Number：
 1635608
Announcement Number：
 100356505
Grant Date：
 2007-12-19
Granted Pub. Date：
 2007-12-19
ApplicationType：
 Invention
State/Country：
 11[]
IPC：
 H01L 21/00H01L 21/324
Applicant(s)：
 Tsinghua University
Inventor(s)：
 Lin Huiwang, Chen Bixian, Wang Shunyuan
Key Words：
 semiconductor, heat-treating facility, heat treating chamber, vertical
Abstract：
 This invention relates to semiconductor rapid thermal process device with vertical process chamber, which belongs to large-scale integration circuit technique field. It is characterized by the following: it comprises the vertical process chamber, loading chamber, semiconductor transistor lifting structure and also mechanic hand sub-system by case to case, micro machine control sub-system, temperature control sub-system, gas device and heating power. The thermal process chamber comprises vertical cylinder quartz heating chamber, top plate graphite heating device in chamber, and side cylinder graphite heating device.
Claim：
Priority：
PCT：
LegalStatus：

Recommend this patent:
1 2 3 4 5
Average ( 0 votes):
                                                                          Recommended Patents>>

Relevancy information



Other Patents of Same Inventor

Single slice three chambers type infrared heating superhigh vacuum CVD epitaxial system
Superhigh vacuum chemical vapor deposition epitoxy system with rotary lining
Openable chip accessing manipulator for high vacuum chemical vapor deposition and epitaxial system
Wide stress area silicon pressure sensor
Silicon tyre-pressure temperature sensor with monochip integration



News & Events More>>

Last Update  
2008-4-17
  Selected patents owned by Tsinghua University filed in 2005 are loaded.
2008-3-31
  Selected patents owned by Tsinghua University filed in 2006 and 2007 are load.







Copyright 2008-2015 All Rights Reserved Patent License of China.      Designed by Easygo