Encapsulation casing, substrate, and sealing structure for moisture-sensitive electronic components |
Title： |
| Encapsulation casing, substrate, and sealing structure for moisture-sensitive electronic components |
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Application Number： |
200510000285 |
Application Date： |
2005/01/10 |
Announcement Date： |
2006/07/19 |
Pub. Date： |
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Publication Number： |
1805130 |
Announcement Number： |
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Grant Date： |
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Granted Pub. Date： |
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ApplicationType： |
Invention |
State/Country： |
11[China|beijing] |
IPC： |
H01L 23/02, H01L 23/12, H01L 51/10, H01L 29/765 |
Applicant(s)： |
Tsinghua University |
Inventor(s)： |
Qiu Yong, Zhang Deqiang, Gao Yudi, Xu Yue, Zhou Shaohua |
Key Words： |
moisture-sensitive electronic components,encapsulation casing, substrate, sealing structure |
Abstract： |
The invention relates to a sealing case, base and sealing structure of humidity sensitive electric device, which can reduce the thickness of the part of sealing material that contacting the environment without reducing the thickness of sealing material. The edge of sealing case and/or base comprises one or several grooves to be filled with sealing material; the humidity sensitive electric device can be used in organic electric lighting device, micro electro-mechanical sensor or the charge-coupled device sensor. The invention via preparing the grooves on the base and/or sealing case fills the sealing material into the grooves to reduce the thickness of the part of sealing material that contacting the environment without reducing the thickness of sealing material, to improve the sealing effect without reducing the adhesive property of base and sealing case, and when there are more grooves, the adhesive property and sealing effect can be improved. |
Claim： |
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Priority： |
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PCT： |
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LegalStatus： |
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