Detection of silicon chip state in box and its center relocation method
Title：
Detection of silicon chip state in box and its center relocation method
Application Number：
 200510135545
Application Date：
 2005/12/30
Announcement Date：
 2006/06/28
Pub. Date：
 2007/09/05
Publication Number：
 1794440
Announcement Number：
 100336194
Grant Date：
 2007-9-5
Granted Pub. Date：
 2007-9-5
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 H01L 21/68, G01B 11/00, G03F 7/20
Applicant(s)：
 Tsinghua Univ.
Inventor(s)：
 Song Yixu, Zhao Yannan, Yang Zehong, Wang Jiaqin, Li Shichang, Jia Peifa, Deng Zhidong
Key Words：
 Detection, silicon chip state, box, center relocation method
Abstract：
 This invention relates to a method for testing a silicon chip state in a box and re-location of its center, in which, the test method includes: designing a light intensity threshold value 10,11, testing the light intensity of any pair of sensors timely of 1S1, if 1S1=!0, then there is no silicon chip, when 10 > 1S1 >11, then there is one, when 1S1 is smaller or equals to 11, there are laminated silicon chips, if the two sensors have different light shading time, then the chips are at the tilted state, the method for re-locating the center includes: when the edges of the chips are tangential to the light-fields of the two sensors at the same time, then the position of a transport mechanical hand on the X direction is P0, when the edges of the chips are tangential to the light-fields of the two sensors, then its position is P1, if P1= P0, then the chips are at the ideal position, if not, the difference between them is the distance should be compensated on the X direction.
Claim：
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PCT：
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2008-4-17
  Selected patents owned by Tsinghua University filed in 2005 are loaded.
2008-3-31
  Selected patents owned by Tsinghua University filed in 2006 and 2007 are load.







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