Combined type processing method for waste printed wiring board
Title：
Combined type processing method for waste printed wiring board
Application Number：
 200610113110
Application Date：
 2006/09/15
Announcement Date：
 2007/02/28
Pub. Date：
Publication Number：
 1919483
Announcement Number：
Grant Date：
Granted Pub. Date：
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 B09B 3/00
Applicant(s)：
 Tsinghua University
Inventor(s)：
 Li Jinhui, Yu Keli
Key Words：
 waste, printed wiring board, combined type, process
Abstract：
 The invention discloses a combined disposing method of waste printing circuit board in the resource utilizing domain, which comprises the following steps: predisposing waste circuit board through vacuum low-temperature pyrolytic technology at 235-250 deg.c, adopting cutting typed grinder to grind the circuit board, sieving the grinded product, separating the copper in the product from glass fiber, extracting the tail gas through vacuum pump less than 1000Pa, adsorbing through activated charcoal to eliminating pollution.
Claim：
Priority：
PCT：
LegalStatus：

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2008-4-17
  Selected patents owned by Tsinghua University filed in 2005 are loaded.
2008-3-31
  Selected patents owned by Tsinghua University filed in 2006 and 2007 are load.







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