Low-temperature vacuum themal dissociation waste printed wiring board preprocessing method
Title：
Low-temperature vacuum themal dissociation waste printed wiring board preprocessing method
Application Number：
 200610113109
Application Date：
 2006/09/15
Announcement Date：
 2007/02/28
Pub. Date：
Publication Number：
 1919482
Announcement Number：
Grant Date：
Granted Pub. Date：
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 B09B 3/00
Applicant(s)：
 Tsinghua University
Inventor(s)：
 Li Jinhui, Yu Keli
Key Words：
 Low-temperature, vacuum, themal dissociation, waste printed wiring board, preprocess
Abstract：
 The invention discloses a predisposing method of low-temperature vacuum pyrolytic waste print circuit in the resource recycling technological domain, which comprises the following steps: placing waste print circuit board in the vacuum pyrolytic furnace, starting pyrolytic furnace to heat, starting vacuum pump, maintaining vacuum degree at 30-1000pa, stopping heating after the inner furnace temperature reaches 200-300 deg.c, insulating, cooling, grinding the waste print circuit board, sieving.
Claim：
Priority：
PCT：
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