Chemical method for silver coating on copper powder surface
Title：
Chemical method for silver coating on copper powder surface
Application Number：
 200610089631
Application Date：
 2006/07/07
Announcement Date：
 2006/12/13
Pub. Date：
Publication Number：
 1876282
Announcement Number：
Grant Date：
Granted Pub. Date：
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 B22F 1/02
Applicant(s)：
 Tsinghua University
Inventor(s)：
 Guo Wenli, Liang Tongxiang, Yan Yinghui, Zhao Xingyu, Hao Shaochang, Tang Chunhe
Key Words：
 copper powder, surface, chemical, silver coating
Abstract：
 The invention relates to a method for copper powder surface chemical plating silver, belonging to field of chemical silver plating. Said method comprises following steps: putting copper powder into diluted acid of 5-10% to remove oxide on surface of copper powder; adding disperser of 1-30% of copper powder by weight, stabilizer of 10-60% of copper powder by weight into deionized water to form reducing liquid, adding copper powder and stirring; adding silver nitrate into deionized water, adding ammonia, stirring and adding sodium-hydroxide and getting silver amine solvent; adding silver amine solvent into reducing liquid under stirring, finishing chemical silver plating of copper surface 10-50 minutes later; filtering, separating and washing, vacuum drying and getting silver-coated copper powder. The process is characterized by simple preparation and raw material, reduced silver-plated layer on container wall by adding silver amine solvent into reducing liquid, high silver converting rate. The electrical resistance of got copper powder is smaller than 2*10-4 omegacm.
Claim：
Priority：
PCT：
LegalStatus：

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2008-4-17
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