Method and equipment for disassembling circuit board using non-contacted impact |
Title: |
Method and equipment for disassembling circuit board using non-contacted impact |
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Application Number: |
200710063510 |
Application Date: |
2007/02/02 |
Announcement Date: |
2007/08/08 |
Pub. Date: |
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Publication Number: |
101014228 |
Announcement Number: |
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Grant Date: |
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Granted Pub. Date: |
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ApplicationType: |
Invention |
State/Country: |
11[China|beijing] |
IPC: |
H05K 3/00B23K 1/018B25B 27/14B25B 27/00 |
Applicant(s): |
Tsinghua University |
Inventor(s): |
Duan Guanghong, Xiang Dong, Wang Jinsong, Yang Jiping |
Key Words: |
Method, equipment, disassembling circuit board, non-contacted impact |
Abstract: |
The invention relates to one method and device to process disable by contact impact on circuit board, which comprises the following steps: adopting u shape tank structure or card tank structure spring fix device circuit board heating circuit board through point or bar or plane impact structure to exert non-contact impact on circuit board scripting, isolating, collection elements and welding after cooling sorting the circuit board and elements. The invention device comprises the following parts: impact lever, point or bar or plane impact structure, compression spring, circuit board spring fix device, blower device and spring network. |
Claim: |
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Priority: |
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PCT: |
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