Alignment method and apparatus for array type optical probe scanning IC photoetching system
Title:
Alignment method and apparatus for array type optical probe scanning IC photoetching system
Application Number:
01123501
Application Date:
2001/07/26
Announcement Date:
2002/01/30
Pub. Date:
2004/02/25
Publication Number:
1333554
Announcement Number:
1139845
Grant Date:
Granted Pub. Date:
2004-2-25
ApplicationType:
Invention
State/Country:
11[China|beijing]
IPC:
B81C 5/00, G03F 7/00, H01L 21/027
Applicant(s):
qinghua Univ.
Inventor(s):
Xu Duanyi, Qi Guosheng, Qian Kun
Key Words:
Alignment method, array type, optical probe scanning, IC, photoetching system
Abstract:
Firstly, according to the defined key points of circuit pattern, coding distinctive characteristics of circuit pattern, etching them on the silicon wafer, setting a pair a calibrating pattern, makingt he calibrating pattern position at circuit pattern place, and the calibrating pattern is formed from calibrating subpatterns. According to the key points of pattern, on the silicon wafer etching calibrating subpattern, when the alignment is made to key point of pattern, fetching calibrating subpattern coordinate and making comparison of said coordinate with recorded coordinate of calibrating subpattern. In the inveneted equipment the working table is placed on the base seat, and driven by precision servo-actuator, the silicon wafer to be worked can be fixed on the working table by means of suction cup, calibrating optical head and optical probe array are positioned over silicon wafer, a pair of calibrating optical heads is positioned in the middle of optical probe array are positioned over silicon wafer, a pair of calibrating optical heads is positioned in the middle of optical probes, the optcial probes array is arranged in the rectangular form. Said invention can save alignment time of pattern and can raise alignmant efficiency.
Claim:
Priority:
PCT:
LegalStatus:

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