Special ceramic cutter material for wire-board or circuit board and preparation method thereof
Title：
Special ceramic cutter material for wire-board or circuit board and preparation method thereof
Application Number：
 200710175262
Application Date：
 2007/09/28
Announcement Date：
 2008/04/09
Pub. Date：
Publication Number：
 101157554
Announcement Number：
Grant Date：
Granted Pub. Date：
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 C04B 35/56, C04B 35/80, C04B 35/622
Applicant(s)：
 Tsinghua University
Inventor(s)：
 Li Jinhui, Yang Lianwei, Liu Huafeng, Shi Pixing
Key Words：
 Special, ceramic cutter material, wire-board, circuit board, preparation method
Abstract：
 The invention discloses a ceramic cutting tool and the preparation method thereof special for a smashing line board or a circuit board, and belongs to the art of the smashing equipment. The ceramic cutting tool takes crystal whisker as the plasticizing material; tungsten carbide as the substrate material; titanium carbide as anti-friction agent; carbon as deoxidizing agent; and chromic compound, lanthanum oxide and cerium oxide as additive. The ingredients are evenly blended and directly molded by heat pressing. The raw material is not taken out until being fully mixed, and is then positioned into the sample heat pressing groove of a hot-press machine. The thermo-compression intensity of pressure is 10-40MPa, and the hot-press temperature ranges from 1,480 to 1,600DEG C. The flexible ceramic cutting tool of the invention is provided with good resilience, wearlessness, high rigidity and chemical stability. The technique of the cutting tool is quite simple and the production period is far shorter than the production period of the conventional preparation method that carries the compression molding of the evenly mixed raw materials first and then the sinter molding. The cutting tool material is fit for the cutting tool special for the making of a waste line board and the smashing equipment of the circuit board.
Claim：
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PCT：
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2008-4-17
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