Chemical plating activating process and metal depositing process therewith
Title：
Chemical plating activating process and metal depositing process therewith
Application Number：
 200510086380
Application Date：
 2005/09/09
Announcement Date：
 2006/03/01
Pub. Date：
Publication Number：
 1740390
Announcement Number：
Grant Date：
Granted Pub. Date：
ApplicationType：
 Invention
State/Country：
 11[China|beijing]
IPC：
 C23C 18/16, C23C 18/31
Applicant(s)：
 Tsinghua Univ.
Inventor(s)：
 Wang Laijun, Wen Mingfen, Li Yushan, Yang Dong, Song Chongli, Chen Jing
Key Words：
 Chemical plating, activating process, metal depositing process
Abstract：
 The present invention belongs to the field of chemical plating technology, and aims at solving the problems of tin ion interference, activation at acid condition, complicated operation, etc. in activating process of chemical plating. The activating process for chemical plating is to perform pre-activation treatment on the substrate without catalytic activity before the chemical plating for depositing metal. Organic alcohol reductant is utilized to reduce active metal component directly for depositing on the substrate to form catalytic activity center and metal grain growth crystal kernel. Then, the activated substrate is set directly inside the chemical plate liquid for chemical plating. Compared with traditional chemical plating activating process, the process of the present invention is simple, no tin ion interference on the activating process, activating in neutral condition and no damage to the substrate.
Claim：
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PCT：
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2008-4-17
  Selected patents owned by Tsinghua University filed in 2005 are loaded.
2008-3-31
  Selected patents owned by Tsinghua University filed in 2006 and 2007 are load.







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